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19
June
2013
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Belden presents new wash-down connectors

Belden announces new Lumberg Automation brand wash-down connectors. Optionally available as single-ended or double-ended actuator/sensor cord sets, these connectors come with an M8 or M12 thread and a hexagonal stainless steel coupling nut.
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18
June
2013
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So you will never run out of battery again

Is there anyone who hasn’t felt the anxiety or frustration of running out of battery just when you were expecting an important call or take a train with your electronic ticket on your mobile phone? Wysips want to change that.
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Microchip with PIC32MX 32-bit microcontroller portfolio

Microchip announces a new family of PIC32MX3/4 microcontrollers (MCUs) in 64/16 KB, 256/64 KB and 512/128 KB Flash/Ram configurations.
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EV Group and Dynaloy cooperate

EV Group and Dynaloy jointly develop complete single-wafer cleaning solution for 3D-IC/TSV, Advanced Packaging, MEMS and compound semiconductor applications.
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Schneider team up with Mouser

Mouser Electronics, has entered into a U.S. distribution agreement with Schneider Electric.
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AMD unveils Server Strategy and Roadmap

AMD disclosed its strategy and roadmap to recapture market share in enterprise and data center servers by unveiling innovative products that address key technologies and meet the requirements of the fastest-growing data center and cloud computing workloads.
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NAND Flash: Benefit from recent replenishment momentum

1H'June NAND Flash contract prices have risen by 2-4% following the recent increase in replenishment demand from the OEM customers.
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STMicro signs agreement with Rambus

STMicroelectronics has signed a comprehensive agreement with Rambus Inc. that expands existing licenses between the two Companies, settles all outstanding claims, and commits both organizations to explore additional opportunities for collaboration.
17
June
2013
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NXP tops ABI Research list

​NXP, Inside Secure, and STMicroelectronics were judged to be the top rated vendors of NFC ICs in ABI Research’s Competitive Assessment.
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XMOS: Low cost daisy-chain Ethernet AVB

XMOS announced a new reference design for its xCORE multicore microcontroller products that brings Ethernet AVB (Audio Visual Bridging) technology.
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Snapdragon 800 processors for Windows RT 8.1

Qualcomm Technologies, Inc., has expanded its Qualcomm Snapdragon 800 processors portfolio to include support for Microsoft Windows RT 8.1.
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Imec and Renesas pioneer in 28nm CMOS technology

imec and Renesas Electronics unveiled the world’s first multi-standard radio frequency (RF) receiver in 28nm CMOS technology, and a 28nm analog-to-digital converter (ADC) targeting wide-bandwidth standards such as LTE-advanced and next-generation WiFi.
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UMC joins IBM chip alliance for 10nm process development

United Microelectronics Corporation (UMC) will join the IBM Technology Development Alliances as a participant in the group’s development of 10nm CMOS process technology.
14
June
2013
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Fujitsu develops clock distribution circuit

Fujitsu Laboratories and Fujitsu Laboratories of America, Inc. developed a clock distribution circuit that enables a 20% reduction in the power consumed by the transceiver circuits in next-generation servers that transmit data between CPUs.
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Communication IC market surges ahead

Surging smartphone shipments coupled with sluggish notebook computer sales are forecast to propel the total communications IC market past the total computer IC market for the first time in history this year, according to IC Insights.
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ALPS strengthens partnership with Qualtré

Alps Electric in May 2013 made an investment in Qualtré, Inc. ALPS and Qualtré already carry out joint development of inertial sensors.
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Infineon and Atmel reach agreement to settle patent dispute

Infineon Technologies AG has settled its patent infringement claim against Atmel Corporation, and both Infineon and Atmel have agreed to seek dismissal of all pending patent infringement claims.
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Broadcom's new Quad-Core HSPA+ processor

Broadcom announced a quad-core HSPA+ processor designed for high-performance, entry-level smartphones.
13
June
2013
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Several executive promotions at Teledyne

There are some big executive changes taking place at Teledyne Technologies at the moment - several executive promotions have been announced that will be effective July 1, 2013.
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ZEISS to acquire Xradia

ZEISS, announces the planned acquisition of the US-based Xradia. Xradia is an medium-size company providing innovative 3D X-ray microscopes for industrial and academic research applications.
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